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TECHNICAL SUPPORT

技術(shù)支持

類型

Type

封裝規(guī)格

Package

負載

Load Capacitance

(pF)

常溫頻差

Freq. Tol.@25℃

(ppm)

溫度特性

Freq.Stability

(ppm)

溫度范圍

Temp. Range

特殊要求

Special

-

頻率

Freq.

M 表晶32.768 

  Tuning Fork

C 貼片晶體諧振器

  Chip Quartz Crystal

G 貼片晶體諧振器

  Chip Quartz Crystal(Glass)

S 49US

A:1612

B:2016

C:2520

D:3215

E:3225

F:5032

G:6035

H:7050

K:8045

I:49S

J:49SMD

K:1x4

L:2x6

M:3x8

N:1610

P:2012

Q:6.9x1.4

R:8.0x3.8

X:12.5

A:6

B:7

C:8

D:9

E:10

F:12

G:15

H:16

I:18

J:20

K:22

L:25

M:30

N:32

P:50

O:No 

S:Series

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:0 ~ +40

B:0 ~ +50

C:0 ~ +60

D:0 ~ +70

E:0 ~ +80

F:0 ~ +85

G:-10 ~ +60

H:-20 ~ +70

I:-30 ~ +85

J:-40 ~ +85

K:-40 ~ +95

L:-40 ~ +105

M:-40 ~ +125

N:-40 ~ +150

P:-55 ~ +125

A:Auto

N:Non Auto

-

類型

Type

封裝規(guī)格

Package

供應(yīng)電壓

Supply V(V)

三態(tài)

Tri-State Fun.

總頻差

Freq. Stability

(ppm)

溫度范圍

Operating Temp. Range


輸出信號模式

Output Logic 

And Symmetry

振蕩模式

Oscillator

Mode

-

頻率

Freq.

O 貼片晶體振蕩器

  SMD Crystal Oscillator (CMOS)

L 貼片晶體振蕩器

  SMD Crystal Oscillator (LVPECL/LVDS)

P 貼片編程晶體振蕩器

  Programmable SMD Crystal Oscillator

V 貼片壓控晶體振蕩器

  SMD VCXO Crystal Oscillator

T 貼片溫補晶體振蕩器

  SMD TCXO Crystal Oscillator

A:1612

B:2016

C:2520

D:3215

E:3225

F:5032

G:6035

H:7050

K:8045

I:49S

J:49SMD

U:8038

V:6914

W:1610

X:2x6

Y:3X8

Z:14.2x9.3

E:2.8/3.0/3.3

J:2.5

K:1.8

P:1.5

L:1.2

M:0.9

T:Fixed-Freq With Tri-State

M:Multiplier-Freq With Tri-State(Only For F/H Package)

U:Ultra Low Noise Design

N:NA

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

P:±0.5

Q:±1.0

R:±1.5

S:±2.0

T:±2.5

U:±3.0

V:±3.5

W:±4.0

X:±4.5

A:0 ~ +40

B:0 ~ +50

C:0 ~ +60

D:0 ~ +70

E:0 ~ +80

F:0 ~ +85

G:-10 ~ +60

H:-20 ~ +70

I:-30 ~ +85

J:-40 ~ +85

K:-40 ~ +95

L:-40 ~ +105

M:-40 ~ +125

N:-40 ~ +150

P:-55 ~ +125

J:CMOS 15pF/50±5%

K:CMOS 15pF/50±10%

L:LVPECL/50±5%

V:LVDS/50±5%

M:HCSL/50±5%

N:HCMOS 15pF/50±5%

H:HCMOS 15pF/50±10%

A:AT 

T:AT 3rd Overtone


類型

Type

封裝規(guī)格

Package

供應(yīng)電壓Supply V(V)

牽引范圍

Pulling  Range

(ppm)

總頻差

Freq. Stability

(ppb)

溫度范圍

Operating Temp.Range

輸出信號模式

Output Logic 

And Symmetry

振蕩模式

Oscillator

Mode

引腳分配

Pin out

含鉛狀態(tài)

Lead Free

-

頻率

Freq.

N 恒溫晶體振蕩器

OCXO Crystal Oscillator

A:14.3x9.3

(SMD)

B:20.3x12,7

C:20.6x20.6

D:25.4x22.1

(SMD)

E:25.4x25.4

F:36.3x27.2

A:3.3

B:5

C:12

A:±0.2

B:±0.4

C:±1

D:±3

E:±5

F:No VC Function

A:±2

B:±5

C:±10

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:0 ~ +50

B:0 ~ +70

C:-30 ~ +70

D:-40 ~ +85

A:Sinewave

B:CMOS15pF/50±5%

H:Not

Not selectable by custome

N:Normal

"(Pleaserefer 

to ""outline drawing"""

F:RoSH Complian-

固定類型

Assembly type

標稱頻率

Nominal Freq.(KHz)

波束類型

Beam type

外殼種類

Case type

連接線種類

Wire type

UA:Passive combination probe

UB:Active combination probe(Analog)

UC:Active combination probe(Digital)

UD:Active combination probe(LIN-BUS,CAN-BUS)

UE:Closed sensor core(T/R)

UK:Open sensor core(T/R)

UT:Open sensor core(T)

UR:Open sensor core(R)

DM:Matching layer Closed sensor core

40:40.0

48:48.0

52:52.0

55:55.5

58:58.0

62:62.0

68:68.0

2H:200

3H:300

4H:400

1M:1000

S:Symmetric

X=Y

D:Dissymmetric 

X>Y

A:14x9 Aluminum case

B:15x9 Aluminum case

C:15.5x9 Aluminum case

D:16x12 Aluminum case

E:16x12 Plastic case

F:18.7x10.5(DM)

G:13.0x9.0(DM)

H:11.0x10.0(DM)

L:Plastic composite housing(Plane)

M:Plastic composite housing(Dip angle)

S:Customer-specified

N:Not specified

1:Stranded wire with Terminal

2:Screw waterproof joint wire(2.5M)

3:Standard shielded wire(2.5M)

4:Pin

5:AV cable

9:Customer-specified

0:Not specified